Automation Solutions Improve Semiconductor Yields

If you’re dealing with wafer microcracking or contamination issues in semiconductor handling and transfer operations, our automation portfolio includes components specifically designed to address these yield limiters. The solutions address both atmospheric and high-vacuum processes.

Atmospheric Process Solutions

For atmospheric applications including photoresist coating, wet cleaning, and chemical mechanical polishing, the line includes several specialized components. An inverted gantry wafer handling system based on the ELGD electric axis is designed for integration into equipment front-end modules (EFEMs).

A combined wafer aligner and end effector uses the Bernoulli effect for non-contact alignment and can flip wafers for inverted loading. The single-unit design reduces transfer steps and EFEM footprint compared to separate alignment stations.

For photoresist dispensing, dosing valves with suck-back functionality prevent nozzle dripping. In CMP applications, piezo valves enable real-time pressure regulation for wafer contact force control.

VEFC and VEMD mass flow controllers handle nitrogen purging for FOUPs and die banks, with piezo technology that can significantly reduce nitrogen consumption compared to conventional approaches—addressing fab operating cost concerns.

High-Vacuum Solutions

Vacuum-rated components target deposition, etching, and ion implantation processes operating at 10⁻⁶ to 10⁻⁸ mbar. The MH2 quick-action valve is rated for 120°C ambient temperatures and provides millisecond switching for atomic layer deposition (ALD) gas sequencing. VTOC manifolds and MH1 valves handle process gas control in gas boxes.

For load-lock regeneration, flow controllers manage the transition between atmospheric and vacuum conditions. Pneumatic gate valve actuators provide low-vibration operation for slit and transfer valves.

Wafer Positioning and Temperature Control

Pneumatic pin lift systems offer micrometer-level positioning within process chambers, with integrated force sensing to detect lift resistance from electrostatic chucks. This force feedback aims to reduce wafer microcracking and breakage during transfer. The pneumatic approach also generates less heat near process chambers compared to electric motor-based systems, as valve manifolds and controllers can be positioned at greater distances from the process chamber.

VZXA angle seat valves handle thermal management fluids between -80°C and +100°C for ESC chuck heating and chamber component cooling.

Integration and Monitoring

Components include IO-Link and fieldbus connectivity for integration with fab control systems. The AX analytics platform can use operational data from valves and actuators for predictive maintenance scheduling.

The solutions support silicon, silicon carbide, and sapphire substrates across 150mm, 200mm, and 300mm wafer formats, with applications extending to advanced packaging processes including hybrid bonding and flip-chip assembly.

For detailed technical specifications or to discuss application-specific requirements, visit Festo’s semiconductor solutions pages or contact our automation specialists directly.

To learn more about our innovative solutions for semiconductor manufacturing, please visit our industry page.